Specification
Form Factor | Thin Mini-ITX 170W x 170D(mm) |
CPU | Support for 7th/6th Generation Intel® Core™ i7/i5/i3 processors, Pentium® & Celeron® processors in the LGA1151 package TDP under 65W L3 cache varies with CPU |
Socket | 1 x LGA 1151 |
Chipset | Intel® H110 Express Chipset |
Memory | 2 x DDR4 SO-DIMM sockets, Max. Capacity 32 GB Support Dual channel DDR4 2400/2133 MHz memory modules |
Ethernet | 1 x GbE LAN Port (Realtek® RTL8111HS) |
Video | Integrated Graphics Processor - depends on CPU : 1 x HDMI 1.4 port, supporting a maximum resolution of 4096x2160 @30Hz 1 x DP port, supporting a maximum resolution of 4096x2160 @60Hz 1 x LVDS port, supporting a maximum resolution of 1920x1080 @60Hz (2 independent display outputs) |
Audio | Realtek® Audio Codec |
Storage | 2 x SATA 6Gb/s Ports |
Expansion Slots | 1 x 2280/2260 M.2 M-Key (PCIe x2, SATA 6Gb/s) 1 x 2230 M.2 E-Key |
Internal I/O | 1 x 2-pin ATX main power connector 1 x SATA Power connector 1 x CPU fan header 1 x System fan header 1 x Front panel header 1 x Front panel audio header 1 x 3W Speaker out header 1 x DMIC header 5 x USB 2.0 headers 1 x COM header (RS-232) 1 x FPD (For LVDS 19V) 1 x FPD_SW 1x3 (For Panel Power SW) 1 x LCD_VCC Pin header 1 x Backlight Control header 1 x Clear CMOS jumper |
Rear I/O | 2 x Audio Jacks (Line out, Mic in) 1 x HDMI 1 x Display Port 1 x RJ45 LAN Port 4 x USB 3.2 Gen 1 1 x DC Jack (+12V/+19VDC) |
TPM | 1 x TPM header |
OS Compatibility | Windows 10 (x64) |
Operating Properties | Operating temperature: 0°C to 60°C Operating humidity: 0-90% (non-condensing) Non-operating temperature: -20°C to 70°C Non-operating humidity: 0%-95% (non-condensing) |
Packing Content | Carton size: 550 x 451 x 330 (mm) Packing Capacity: 20pcs Single Board weight: Approx. 0.45kg Including: IO Shield x 1 (P/N: 12AIO-H77TN3-00R) IO Shield STD x 1 (P/N: 12AIO-H77TN4-00R) Screw Flat Head M2*2.5 GTY x 1 (P/N: 12KS2-110202-01R) Screw M3x3L D=5 FLAT HEAT ST x 1 (P/N: 25982G-1C024-S00) SATA Power cable x 1 (P/N: 25CRI-270320-D3R) |
Order Information | 9MDH11KINR-SI (Bulk Packing) |
Optional Kit | TPM 2.0 module: 9CTM000NR-00 |