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GIGAIPC iTXL-H110C
  • Thin Mini-ITX with Intel® H110 Chipset, support 7th/6th Generation Intel® Core™ Processors
  • Dual channel DDR4 memory, 1 x COM, 9 x USB, 2 x SATA 6Gb/s



Key Features
  • Thin Mini-ITX form factor
  • Support 7th/6th Generation Intel® Core™ Processos
  • Intel® H110 Express Chipset
  • Dual Channel DDR4, 2 x SO-DIMMs
  • 1 x GbE LAN Port
  • 2 x SATA 6Gb/s Ports
  • HDMI, Display Port, LVDS ports for multiple display
  • 1 x COM Port (RS-232)





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Specification


Form Factor

Thin Mini-ITX

170W x 170D(mm)

CPU

Support for 7th/6th Generation

Intel® Core™ i7/i5/i3 processors, Pentium® & Celeron® processors in the LGA1151 package

TDP under 65W

L3 cache varies with CPU

Socket

1 x LGA 1151

Chipset

Intel® H110 Express Chipset

Memory

2 x DDR4 SO-DIMM sockets, Max. Capacity 32 GB

Support Dual channel DDR4 2400/2133 MHz memory modules

Ethernet

1 x GbE LAN Port (Realtek® RTL8111HS)

Video

Integrated Graphics Processor - depends on CPU :

1 x HDMI 1.4 port, supporting a maximum resolution of 4096x2160 @30Hz

1 x DP port, supporting a maximum resolution of 4096x2160 @60Hz

1 x LVDS port, supporting a maximum resolution of 1920x1080 @60Hz


(2 independent display outputs)

Audio

Realtek® Audio Codec

Storage

2 x SATA 6Gb/s Ports

Expansion Slots

1 x 2280/2260 M.2 M-Key (PCIe x2, SATA 6Gb/s)

1 x 2230 M.2 E-Key

Internal I/O

1 x 2-pin ATX main power connector

1 x SATA Power connector

1 x CPU fan header

1 x System fan header

1 x Front panel header

1 x Front panel audio header

1 x 3W Speaker out header

1 x DMIC header

5 x USB 2.0 headers

1 x COM header (RS-232)

1 x FPD (For LVDS 19V)

1 x FPD_SW 1x3 (For Panel Power SW)

1 x LCD_VCC Pin header

1 x Backlight Control header

1 x Clear CMOS jumper
Rear I/O

2 x Audio Jacks (Line out, Mic in)

1 x HDMI

1 x Display Port

1 x RJ45 LAN Port

4 x USB 3.2 Gen 1

1 x DC Jack (+12V/+19VDC)

TPM

1 x TPM header

OS Compatibility

Windows 10 (x64)

Operating Properties

Operating temperature: 0°C to 60°C

Operating humidity: 0-90% (non-condensing)

Non-operating temperature: -20°C to 70°C

Non-operating humidity: 0%-95% (non-condensing)

Packing Content

Carton size: 550 x 451 x 330 (mm)

Packing Capacity: 20pcs


Single Board weight: Approx. 0.45kg

Including:

IO Shield x 1 (P/N: 12AIO-H77TN3-00R)

IO Shield STD x 1 (P/N: 12AIO-H77TN4-00R)

Screw Flat Head M2*2.5 GTY x 1 (P/N: 12KS2-110202-01R)

Screw M3x3L D=5 FLAT HEAT ST x 1 (P/N: 25982G-1C024-S00)

SATA Power cable x 1 (P/N: 25CRI-270320-D3R)

Order Information

9MDH11KINR-SI (Bulk Packing)

Optional Kit

TPM 2.0 module: 9CTM000NR-00